UMC joins IBM Chip Alliance
New Delhi, India, June 14, 2013: IBM and United Microelectronics Corporation, a leading global semiconductor foundry, has announced that UMC will join the IBM Technology Development Alliances as a participant in the group’s development of 10nm CMOS process technology.
Po Wen Yen, CEO at UMC, said, “IBM is a recognized leader in fundamental semiconductor technology. We are extremely pleased to work jointly with IBM on advanced fundamentals, and to contribute our many years of experience in developing highly competitive manufacturing technology. Our role as one of the world’s top foundries requires us to introduce leading-edge processes in a timely manner to enable next generation customer chip designs. We look forward to collaborating closely with IBM, leveraging their deep technology expertise to shorten our 10nm and FinFET R&D cycles and create a win-win situation for UMC and our customers.”
Gary Patton, VP, IBM Semiconductor Research & Development, said, ”Established over a decade ago, the IBM alliance allows the partners to leverage our combined expertise and collaborative research and innovative technology development to address the demanding needs for advanced semiconductor applications. UMC is a strong addition to the alliance.”
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